الكلمة المفتاحية
منتجات أخرى
I36DUA-UMW
يجمع موديل I36DUA بين أداء مرتفع وتشغيل هادئ.
   
   
I75DUE-CMW
يستخدم الألمنيوم المقذوف مادة خليط ألمنيومي ويبعد تصميم الريشة الإشعاعية الهواء الحار عن الـ سي بي يو. ناقل حرارة سريع، تثبيت مختص.
   
   
F1-IACSHA
Excellent thermal performance and ultra silent 1.99.97% pure copper and heat pipe technology provides high thermal
   
   
 >> الصفحة الرئيسية > أخبار ساخنة > ThermalFly I75DUH Heatsink

I75DUH CPU Cooler

The heatsink is made up of two parts - the first an outer ring of extruded aluminum, the center a solid 33mm block of copper. The processor makes direct contact with that copper block, and it in turn spreads the heat energy so the aluminum fins can work more efficiently at transferring it to the surrounding environment. This is the same basic design principle used by Intel RCBFH-3 reference thermal solution.

 

 

 

 ThermalFly Office committed to using lighter weight materials, lower noise and lower manufacturing cost to deliver superior cooling solutions. The result is increased value for our customers with lighter system board loading, quiet working environment and optimal price performance. Price performance, weight performance, and noise performance are our cooling design philosophy.

Click here for more information.

 

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